Copper

High thermal/electrical conductivity, antimicrobial surface, develops natural patina over time.

Price:

Lead Time:

< 10 days

Wall Thickness:

0.75 mm

Tolerances:

±0.005″ (±0.125mm)

Max Part Size:

200 cm x 80 cm x 100 cm

Copper C101 (T2)

99.99% pure copper with ≤0.0005% oxygen content, offering supreme electrical/thermal conductivity and ductility. Suitable Processes‌: Cold working, deep drawing, precision machining, vacuum brazing. Applications‌: High-frequency coaxial cables, semiconductor lead frames, and ultra-high-vacuum components.

Tensile Strength, Yield (MPa)

Fatigue Strength (MPa)

Elongation at Break (%)

VHardness (Brinell)

Density (g/cm³)

100-400

80-150

15-60

60-100

8.94

Copper C103(T1)

Deoxidized copper with 0.003-0.012% phosphorus, providing excellent weldability and reduced embrittlement risk. Suitable Processes‌: Gas welding, soldering, hot forging, pipe bending. Applications‌: Heat exchanger tubes, architectural roofing, and plumbing fittings.

Tensile Strength, Yield (MPa)

Fatigue Strength (MPa)

Elongation at Break (%)

VHardness (Brinell)

Density (g/cm³)

100-380

70-140

4-45

55-90

8.89-8.94

Copper C103(TU2)

Fire-refined grade with 99.95% Cu purity and controlled impurities for cost-effective conductivity. Suitable Processes‌: Hot rolling, continuous casting, resistance welding. Applications‌: Electrical busbars, transformer windings, and grounding straps.

Tensile Strength, Yield (MPa)

Fatigue Strength (MPa)

Elongation at Break (%)

VHardness (Brinell)

Density (g/cm³)

110-370

75-150

5-50

60-95

8.89-8.94

Copper C110(TU0)

Standard industrial copper (99.9% Cu) containing 0.02-0.05% oxygen for improved castability. Suitable Processes‌: Extrusion, stamping, electroplating, EDM. Applications‌: Power cables, printed circuit boards, and electromagnetic shielding.

Tensile Strength, Yield (MPa)

Fatigue Strength (MPa)

Elongation at Break (%)

VHardness (Brinell)

Density (g/cm³)

110-350

70-100

20-50

65-90

8.89

pros

High Electrical Conductivity: Ensures minimal energy loss and efficient performance.
High Thermal Conductivity: Ideal for heat exchangers, radiators, and other thermal management systems.
Corrosion Resistance: Long-lasting and able to withstand harsh environments.
Malleability and Ductility: Easily shaped and formed into complex designs.
Biostatic Properties: Resists bacterial growth and is useful in medical applications.
Durability: Long lifespan, reducing the need for frequent replacements

cons

Softness: Prone to deformation under stress, challenging to maintain tight tolerances.
Gummy Nature: Adheres to cutting tools, leading to poor surface finishes and increased tool wear.
Cost: Higher material and machining costs compared to other metals.
Thermal Expansion: This can affect dimensional stability during temperature fluctuations.